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Thermal Grease

Okong thermally conductive conpound are greaselike silicone materials, heavily filled with
heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds resist changes in consistency at
temperature up to 180¡É, maintaining a positive heat sink seal to improve heat transfer
from the electrial/electronic device to the heat sink or chassis, therby increasing the
overall efficiency of the device.
Type
Non-curing; thermally conductive silicone pasres
Special Properties
High thermal conductivity; low bleed; high-temperature stability
Potential Uses
Gap fill materials between heat sources abd heat sinks

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ºñ°æÈ­Çü: ¿­Àüµµ¼º ½Ç¸®ÄÜ ÆäÀ̽ºÆ®
¶Ù¾î³­ ¿­Àüµµ¼º: ³·Àº ÀÌÀ¯µµ: ³ôÀº ¿Âµµ¿¡¼­ÀÇ ¾ÈÁ¤¼º

* Àû¿ëºÐ¾ß
¹ß¿­¿ø°ú ¹æ¿­ÆÇ »çÀÌÀÇ Ä¸ ÃæÁøÀç·Î »ç¿ë
¹æ¿­ÆÇ/IC/CPU

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Polydimethylsiloxane
Zonc oxide

Contact Point:
E-mail: kmb3d@hanmail.net (010-5522-8588)
TEL: 054-443-9497
FAX: 054-443-9498
    
Á¦¸ñ: Thermal Grease


»çÁø°¡: mikekang * http://www.reignd.co.kr

µî·ÏÀÏ: 2012-08-28 18:40
Á¶È¸¼ö: 11904


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